Item description for Low Dielectric Constant Materials for IC Applications by Paul S. Ho...
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
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Est. Packaging Dimensions: Length: 9.68" Width: 6.4" Height: 0.7" Weight: 1.31 lbs.
Release Date Dec 16, 2002
ISBN 3540678190 ISBN13 9783540678199
Availability 136 units. Availability accurate as of Mar 29, 2017 07:06.
Usually ships within one to two business days from La Vergne, TN.
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More About Paul S. Ho
University of Texas
Paul S. Ho has an academic affiliation as follows - University of Texas at Austin University of Texas, Austin University o.