Item description for Chemical Mechanical Planarization of Semiconductor Materials by M. R. Oliver...
This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Promise Angels is dedicated to bringing you great books at great prices. Whether you read for entertainment, to learn, or for literacy - you will find what you want at promiseangels.com!
Est. Packaging Dimensions: Length: 0.75" Width: 6.25" Height: 9.5" Weight: 2.02 lbs.
Release Date Mar 19, 2004
ISBN 3540431810 ISBN13 9783540431817
Availability 129 units. Availability accurate as of May 28, 2017 10:59.
Usually ships within one to two business days from La Vergne, TN.
Orders shipping to an address other than a confirmed Credit Card / Paypal Billing address may incur and additional processing delay.
Reviews - What do customers think about Chemical Mechanical Planarization of Semiconductor Materials?
CMP: An Overview May 25, 2005
This is an outstanding book. It provides an overview of the current status of CMP and serves as a significant update to Steigerwald's 1997 book, which summarized the state of CMP knowledge (which began for electronic applications in 1991)at that time. Much has happened in the second half of CMP's existence.
The book is well edited by Mike Oliver. It includes chapters written by well known CMP specialists that focus on process aspects (technology, equipment, pads, cleaning), on metals (theory and applications), on slurries, and on patterned wafers. It also provides chapters with overviews of CMP. Each chapter has extensive references.
The individual chapters are carefully written to offer an introduction and broad perspectives to new CMP workers while providing depth of insight and material for experienced practitioners. This is an ideal book for advanced undergraduates and graduate students who are working in the field and for those who are starting to do planarization of semiconductor materials. It is also an ideal reference book for experienced polishers since it gives information about the process at a level that is useful and insightful.
I have found the book very useful to me both for its clear summaries of material that I already know about and for its helpful explanations of areas that I am not familiar with. I highly recommend it.