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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: from Particle Scale to Feature, Die and Wafer Scales [Hardcover]

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Item description for Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: from Particle Scale to Feature, Die and Wafer Scales by Jainfeng Luo & David Dornfeld...

This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model"can beparticularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP.





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Item Specifications...


Pages   311
Est. Packaging Dimensions:   Length: 0.75" Width: 6.25" Height: 9.25"
Weight:   1.35 lbs.
Binding  Hardcover
Release Date   Nov 23, 2004
Publisher   Springer
ISBN  354022369X  
ISBN13  9783540223696  


Availability  0 units.


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